Samsung and AMD Expand Collaboration on Next-Generation Memory and AI Computing
Samsung Electronics and AMD have signed a memorandum of understanding (MOU) to deepen their strategic collaboration on advanced memory and artificial intelligence computing technologies. The agreement, announced today, March 19, 2026, aims to bolster both companies’ positions in the rapidly evolving AI market.
The signing ceremony took place at Samsung’s most advanced chip manufacturing complex in Pyeongtaek, South Korea, and was attended by AMD President and CEO Dr. Lisa Su and Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics.
“Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration,” said Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics. “From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver comprehensive, turnkey capabilities that support the evolution of AMD’s AI roadmap.”
▲ Samsung Electronics Vice Chairman and CEO Young Hyun Jun (left) and AMD President and CEO Dr. Lisa Su pose with the memorandum of understanding following the ceremony held at Samsung’s most advanced chip manufacturing complex in Pyeongtaek, Korea.
“Driving the next generation of AI infrastructure requires deep industry collaboration,” stated Dr. Lisa Su, President and CEO of AMD. “We are excited to expand our work with Samsung, combining their leadership in advanced memory with our Instinct GPUs, EPYC CPUs, and rack-scale platforms. Integration across the entire compute stack – from silicon to system and rack – is essential to accelerate AI innovation that translates into real, large-scale impact.”
Under the terms of the MOU, Samsung and AMD will align on the supply of HBM4 for AMD’s next-generation AI accelerator, the AMD Instinct MI455X GPU, as well as advanced DRAM solutions for 6th generation AMD EPYC CPUs, codenamed “Venice.” These technologies will support next-generation AI systems combining AMD Instinct GPUs, AMD EPYC CPUs, and rack-scale architectures like the AMD Helios platform. The collaboration comes as demand for high-bandwidth memory solutions continues to rise amid the AI boom.
Samsung and AMD are already working closely on advanced memory technologies for AI and data center workloads. As memory bandwidth and power efficiency become increasingly critical for system-level performance, this collaboration aims to deliver a more optimized AI infrastructure for customers.
▲ Dr. Lisa Su, President and CEO of AMD, observes a state-of-the-art semiconductor production line during a visit to the factory at Samsung’s most advanced chip manufacturing complex in Pyeongtaek, Korea.
Samsung’s HBM4 is the first in the industry to enter mass production, built on its most advanced sixth-generation 10-nanometer (nm) class DRAM (1c) process and a 4nm logic die, with processing speeds of up to 13 gigabits per second (Gbps) and a maximum bandwidth of 3.3 terabytes per second (TB/s), exceeding industry standards.
Driven by Samsung’s industry-leading performance, reliability, and power efficiency, the HBM4 is expected to create the AMD Instinct MI455X GPU an optimal solution for high-performance systems handling the training and inference of AI models.
The MI455X GPU will serve as a key component for the AMD Helios rack-scale architecture, designed to deliver the performance and scalability needed for next-generation AI infrastructure.
As part of their collaboration, Samsung and AMD will also work together on high-performance DDR5 memory optimized for 6th generation AMD EPYC CPUs. The companies aim to deliver industry-leading DDR5 solutions for systems based on the AMD Helios rack-scale architecture.
The two companies will also discuss opportunities for foundry collaboration, whereby Samsung would provide manufacturing services for future AMD products.
Samsung and AMD have collaborated for nearly two decades on graphics, mobile, and computing technologies, including Samsung’s role as a leading HBM3E partner for AMD, powering the latest AMD Instinct MI350X and MI355X AI accelerators.
About AMD
AMD (NASDAQ: AMD) drives innovation in high-performance computing and AI to solve the world’s most complex challenges. Today, AMD technology powers billions of experiences in cloud and AI infrastructure, embedded systems, AI-powered PCs, and gaming. With a broad portfolio of CPUs, GPUs, networking, and AI-optimized software, AMD delivers complete AI solutions that provide the performance and scalability needed for a new era of intelligent computing. Learn more at www.amd.com
