FEVM is aiming for an ultra-thin form factor without compromising connectivity or storage in a modern PC chassis measuring just 19mm thick and targeting a 55W power draw.
FEVM Unveils Ultra-Slim Mini-PC Based on Intel Core Ultra 300
Images shared by Huang514613 reveal a new ultra-compact PC from FEVM built around the Intel Core Ultra 300 series. The system measures 169 × 108 × 19 mm, approaching the dimensions of an ultra-compact desktop rather than a traditional mini-PC. This compact design is particularly notable given the targeted thermal design power (TDP) of 55W.
While appearing fanless at first glance, specifications suggest a dual-fan cooling solution to manage the 55W TDP. The ventilation system isn’t visible in the available images, but is likely concealed beneath or along the edges of the chassis. The trend toward smaller form factors continues to push the boundaries of thermal management in PC design.
Robust Connectivity and Flexible Storage Options
The leaked configuration boasts both 10GbE and 2.5GbE connectivity, alongside two Thunderbolt 4 ports and a 100W USB PD input. For storage, the system is expected to accommodate three M.2 slots: one PCIe 5.0 x4, one PCIe 4.0 x4 with OCuLink adapter compatibility, and one PCIe 4.0 x2.
An official product page has not yet been located. FEVM is reportedly developing a new chassis, with a refined design that has historically been difficult to find in stock outside of select markets.
If the specifications prove accurate, the combination of 10GbE, Thunderbolt 4, and a PCIe 5.0 x4 M.2 slot within a 19mm chassis positions this model as a technical showcase. Thermal performance at 55W and actual availability remain key questions that will determine its appeal to integrators and labs seeking a high-bandwidth, compact node. You can find more details at VideoCardz.
